Self-forming top anti-reflective coating compositions and, photoresist mixtures and method of imaging using same
AssigneeInternational Business Machines Corporation
InventorsWu-Song Huang, Irene Popova, Pushkara Rao Varanasi, Libor Vyklicky
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Abstract
A composition of matter. The composition of matter includes a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety. Also a photoresist formulation including the composition of matter and a method of imaging using the photoresist formulation including the composition of matter.
Claims28
A composition of matter, comprising:
- a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety;
- and
- a casting solvent.
A photoresist formulation, comprising:
- a photoresist polymer;
- at least one photoacid generator;
- a casting solvent;
- and
- a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety, wherein said polymer has a refractive index of less than about 1.53 with respect to a radiation wavelength of about 193 nm.
A method of forming a patterned material feature, comprising:
- (a) applying a photoresist formulation over a material on a substrate, said photoresist formulation comprising:
- a photoresist polymer;
- at least one photoacid generator;
- a casting solvent;
- and
- a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety, wherein said polymer has a refractive index of less than about 1.53 with respect to a radiation wavelength of about 193 nm;
- after (a), (b) said photoresist formulation separating to form a top anti-reflective coating and a photoresist layer, said photoresist layer between said anti-reflective coating and said substrate;
- after (b), (c) patternwise exposing said photoresist layer to actinic radiation thereby creating a pattern of radiation-exposed regions in said photoresist layer;
- after (c), (d) selectively removing said antireflective coating and said radiation-exposed regions in said photoresist layer to form openings through said photoresist layer;
- and
- after (d), (e) etching or ion implanting through said openings to form said patterned material features.
Dependencies are inferred from the claim text.