Method for inspecting and judging photomask blank or intermediate thereof
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYukio INAZUKI, Hideo Kaneko, Hiroki Yoshikawa
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Abstract
A photomask blank having a film on a substrate is inspected by (A) measuring a surface topography of a photomask blank having a film to be inspected for stress, (B) removing the film from the photomask blank to provide a treated substrate, (C) measuring a surface topography of the treated substrate, and (D) comparing the surface topography of the photomask blank with the surface topography of the treated substrate, thereby evaluating a stress in the film.
Claims8
A method for inspecting a photomask blank or an intermediate thereof having a film on a substrate, comprising the steps of:
- (A) measuring a surface topography of a photomask blank or intermediate having a film to be inspected for stress,
- (B) removing the film from the photomask blank or intermediate to provide a treated substrate,
- (C) measuring a surface topography of the treated substrate after removal of the film, and
- (D) comparing the surface topography of the photomask blank or intermediate prior to film removal with the surface topography of the treated substrate after film removal, thereby evaluating a stress in the film.
Dependencies are inferred from the claim text.