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AssigneesAgency for Science Tecnology and Research, Nanyang Tecnological University
InventorsChee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lock
Estimating the term…
An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
A micro device interconnect structure comprising:
A micro device interconnect structure for interconnecting first and second components, the interconnect structure comprising:
A micro device interconnect structure for interconnecting a multiple component stack and a substrate, the interconnect structure comprising:
A method of fabricating a micro device interconnect structure, the method comprising:
Dependencies are inferred from the claim text.