Semiconductor apparatus and heat conductive sheet

A semiconductor apparatus comprising:

• a semiconductor device;
• a circuit board on which the semiconductor device is mounted;
• a heatsink located on a side of the circuit board opposite to the semiconductor device;
• a connection member that fixes the heatsink to the circuit board with the heatsink separated from the circuit board by a predetermined distance;
• and
• a heat conductive sheet disposed between the circuit board and the heatsink, the semiconductor device being thermally connected to the heatsink through the circuit board and the heat conductive sheet,
• wherein the heat conductive sheet includes a first member and a second member that is laminated onto the first member,
• wherein the electrical insulation of the first member is higher than that of the second member, and
• wherein the elasticity of the second member is higher than that of the first member.

A heat conductive sheet that conducts heat from a semiconductor device to a heatsink, the heat conductive sheet comprising:

• a first member;
• and
• a second member laminated onto the first member,
• wherein one of the first member and the second member is a ceramic board, and the other is a resin sheet material having a highly heat conductive filler mixed therein.