Heat sink and motherboard assembly utilizing the heat sink
AssigneeHon Hai Precision Industry Co., Ltd.
InventorZHENG-HENG SUN
Life of this patent
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Abstract
A heat sink for dissipating heat for a motherboard, includes a package portion, a heat dissipating device made of heat conducting material, and a number of grounding pins made of heat conducting material. The package portion includes a top wall. The heat dissipating device is exposed out of the top wall of the package portion. The number of grounding pins extending down through the package portion, to be soldered to a number of bonding grounding pads of a corresponding idle chip installing area of the motherboard, respectively. Top portions of the grounding pins contact the heat dissipating device. A motherboard assembly utilizing the heat sink is also disclosed.
Claims12
A heat sink for dissipating heat for a motherboard, the heat sink comprising:
- a package portion comprising a top wall;
- a heat dissipating device made of heat conducting material, the heat dissipating device being exposed out of the top wall of the package portion;
- and
- a plurality of grounding pins made of heat conducting material, the plurality of grounding pins extending down through the package portion, to be soldered to a plurality of bonding grounding pads of a corresponding chip installing area of the motherboard, wherein top portions of the plurality of grounding pins contact the heat dissipating device.
A motherboard assembly comprising:
- a motherboard comprising an idle chip installing area, the idle chip installing area comprising a plurality of bonding grounding pads;
- and
- a heat sink comprising a package portion, a heat dissipating device exposed out of a top of the package portion, and a plurality of grounding pins contacting the heat dissipating device and extending down through the package portion, wherein the heat dissipating device and the plurality of grounding pins are made of heat conducting material, the plurality of grounding pins are soldered to the plurality of bonding grounding pads, respectively.
Dependencies are inferred from the claim text.