Circuit Pack Cooling Solution
AssigneeAlcatel-Lucent USA Inc.
InventorsDomhnaill Hernon, Todd R. Salamon
Life of this patent
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Abstract
An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.
Claims33
An apparatus for dissipating heat in a circuit pack having a plurality of heat generating components, comprising:
- a heat spreader including at least one of a heat pipe and a vapor chamber for spreading heat therein;
- wherein the heat spreader is in thermal communication with the plurality of heat generating components of the circuit;
- and
- wherein the heat spreader is in thermal communication with a heat sink to convey heat thereto.
(canceled)
An apparatus for dissipating heat in a circuit pack having a plurality of heat generating components, comprising:
- at least one heat pipe in thermal communication with a respective one of the plurality of heat generating components;
- and
- a common heat pipe in thermal communication with the at least one heat pipe to move heat toward a heat sinking region.
A circuit pack system, comprising:
- a plurality of heat generating components;
- and
- a heat spreader including at least one of a heat pipe and a vapor chamber;
- wherein the heat spreader is in thermal communication with the plurality of heat generating components;
- and
- wherein the heat spreader is in thermal communication with a heat sink to convey heat thereto.
(canceled)
A circuit pack system, comprising:
- a plurality of heat generating components;
- at least one heat pipe in thermal communication with a respective one of the plurality of heat generating components;
- and
- a common heat pipe in thermal communication with the at least one heat pipe to move heat toward a heat sinking region.
A method of dissipating heat in a circuit pack having a plurality of heat generating components, comprising:
- disposing a heat spreader including at least one heat pipe in thermal communication with the plurality of heat generating components to dissipate thereby at least a portion of generated heat;
- wherein the heat spreader is in thermal communication with a heat sink to convey heat thereto.
A method of dissipating heat in a circuit pack having a plurality of heat generating components, comprising:
- disposing at least one heat pipe in thermal communication with a respective one of the plurality of heat generating components;
- disposing a common heat pipe in thermal communication with the at least one heat pipe to dissipate thereby at least a portion of generated heat;
- wherein the common heat pipe in thermal communication with the at least one heat pipe is configured to move heat toward a heat sinking region.
Dependencies are inferred from the claim text.