Method and Apparatus for Thermal Management of a Radio Frequency System
AssigneeRaytheon Company
InventorsAngelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
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AssigneeRaytheon Company
InventorsAngelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
Estimating the term…
A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).
An integrated panel array assembly (IPAA) comprising:
A phased array comprising:
A thermal management system comprising:
An apparatus, comprising:
A method of operating an antenna system which includes a thin and generally planar antenna panel having first and second opposing surface and having a plurality of antenna elements disposed to emit and receive radio frequency signals through a first one of the first and second surfaces and a plurality of active panels electrically coupled to the antenna panel, the method comprising the steps of:
Dependencies are inferred from the claim text.