Semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• a semiconductor module that has a joint surface, a first fitting portion and a second fitting portion provided on the joint surface;
• and
• a radiating fin that has a joint surface, a third fitting portion and a fourth fitting portion provided on the joint surface;
• wherein the semiconductor module is bonded to the radiating fin so that the first fitting portion is fitting into the third fitting portion or the third fitting portion is fitting into the first fitting portion, and the second fitting portion is fitting into the fourth fitting portion or the fourth fitting portion is fitting into the second fitting portion;
• and
• wherein the semiconductor module is fixed to the radiating fin by driving a screw penetrating the joint surfaces of the first fitting portion and the third fitting portion, and a screw penetrating the joint surfaces of the second fitting portion and the fourth fitting portion.

A method for manufacturing a semiconductor device, comprising the steps of:

• manufacturing a semiconductor module that has a joint surface, a first fitting portion and a second fitting portion provided on the joint surface, the second fitting portion having a shape different the first fitting portion;
• manufacturing a radiating fin that has a joint surface, a third fitting portion and a fourth fitting portion provided on the joint surface, the fourth fitting portion having a shape different from the third fitting portion;
• bonding the semiconductor module to the radiating fin so that the first fitting portion is fitting into the third fitting portion or the third fitting portion is fitting into the first fitting portion, and the second fitting portion is fitting into the fourth fitting portion or the fourth fitting portion is fitting into the second fitting portion;
• and
• fixing the semiconductor module to the radiating fin by driving a screw penetrating the joint surfaces of the semiconductor module and the radiating fin after bonding the semiconductor module to the radiating fin;
• wherein the first fitting portion is formed into a shape not to fit into the fourth fitting portion and the fourth fitting portion is formed into a shape not to fit into the first fitting portion;
• and
• wherein the second fitting portion is formed into a shape not to fit into the third fitting portion and the third fitting portion is formed into a shape not to fit into the second fitting portion.

A method for manufacturing a semiconductor device, comprising the steps of:

• manufacturing a semiconductor module that has a joint surface, a first fitting portion and a second fitting portion provided on the joint surface;
• manufacturing a radiating fin that has a joint surface, a third fitting portion and a fourth fitting portion provided on the joint surface;
• bonding the semiconductor module to the radiating fin so that the first fitting portion is fitting into the third fitting portion or the third fitting portion is fitting into the first fitting portion, and the second fitting portion is fitting into the fourth fitting portion or the fourth fitting portion is fitting into the second fitting portion;
• and
• fixing the semiconductor module to the radiating fin by driving a screw penetrating the joint surfaces of the first fitting portion and the third fitting portion, and a screw penetrating the joint surfaces of the second fitting portion and the fourth fitting portion after bonding the semiconductor module to the radiating fin.