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US 2010/0244218 A1Published application
Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSeungYong Chai, Sang-Ho Lee
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; depositing a through-conductor on the base substrate; depositing a semiconducting layer on the base substrate and around the through-conductor; forming a metal trace connected to the through-conductor; depositing a dielectric surrounding the metal trace; and removing the base substrate.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- depositing a through-conductor on the base substrate;
- depositing a semiconducting layer on the base substrate and around the through-conductor;
- forming a metal trace connected to the through-conductor;
- depositing a dielectric surrounding the metal trace;
- and
- removing the base substrate.
4 more elements
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- depositing a through-conductor on the base substrate;
- depositing a semiconducting layer on the base substrate and around the through- conductor;
- forming a metal trace connected to the through-conductor;
- depositing a dielectric surrounding the metal trace;
- removing the base substrate;
- mounting a substrate below the metal trace;
- and
- connecting the substrate to the metal trace with an interconnect.
6 more elements
An integrated circuit packaging system comprising:
- a semiconducting layer;
- a through-conductor through the semiconducting layer;
- a metal trace connected to the through-conductor;
- and
- a dielectric that surrounds the metal trace.
2 more elements
Dependencies are inferred from the claim text.