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US 2010/0244181 A1Published application
Filling Gaps in Integrated Circuit Fabrication
OwnerCarlo Demuroinventor
Life of this patent
Estimating the term…
Abstract
A gap may be filled using deposition and sputtering by forming a liner and a gap fill material in the same deposition chamber in some embodiments. The liner may be made harder than the gap fill so that the liner protects the underlying substrate when sputtering is used during the gap fill.
Claims20
A method comprising:
- forming a liner in a gap formed in a substrate, to protect the substrate from sputtering;
- and
- filling the gap, with the liner in place, using deposition and sputtering.
An apparatus comprising:
- a substrate including a plurality of gaps;
- a liner in said gap;
- and
- a gap fill in said gap over said liner, said liner being harder than said gap fill.
1 more element
A method comprising:
- forming a liner in gap;
- filling said gap with a gap fill with said liner in place, using deposition and sputtering, and making said liner harder than the gap fill;
- and
- using the same deposition tool to form said liner and said gap fill.
1 more element
Dependencies are inferred from the claim text.