Method For Applying A Thin-Film Encapsulation Layer Assembly To An Organic Device, And An Organic Device Provided With A Thin-Film Encapsulation Layer Assembly Preferably Applied With Such A Method

A method for applying a thin-film encapsulation layer assembly to an organic device, wherein the organic device comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein the thin-film encapsulation layer assembly is formed by applying at least one organic layer and at least one inorganic layer on the active stack, wherein the at least one inorganic layer is applied with plasma enhanced chemical vapor deposition (PECVD) or reactive sputtering, the method comprising:

• applying a metal layer, after application of a first organic layer of the thin-film encapsulation layer assembly, to the first organic layer;
• and
• applying an inorganic layer to the metal layer using PECVD or reactive sputtering, wherein the metal layer is applied to the first organic layer using a relatively low level radiation deposition technique in comparison to the technique for applying the inorganic layer, and wherein the metal layer is arranged to protect the organic layer from radiation during the subsequent PECVD or reactive sputtering process during the applying an inorganic layer step.