Component mounting apparatus and method
AssigneePanasonic Corporation
InventorsYasuto Onitsuka, Atsushi Katayama
Life of this patent
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AssigneePanasonic Corporation
InventorsYasuto Onitsuka, Atsushi Katayama
Estimating the term…
A component mounting apparatus includes: a plurality of pressure-bonding units which are arrayed in line and each of which includes a pressure-bonding head for pressure-bonding a component to a component pressure-bonding area of the substrate, and an edge-portion support member for supporting an edge portion of the substrate during the pressure bonding; a guide support member for supporting the pressure-bonding units so that their movement along the edge portion for execution of substrate pressure-bonding can be guided; a common head up/down unit for integrally moving up and down the individual pressure-bonding heads; and a plurality of unit-moving devices which are provided for the plurality of pressure-bonding units, individually and respectively, to move the pressure-bonding units along the edge portion so that placement of the pressure-bonding units is changed.
1-13. (canceled)
A component mounting apparatus for pressing and thereby pressure-bonding components to a component pressure-bonding area in an edge portion of a substrate, the apparatus comprising:
A component mounting method for pressing and thereby pressure-bonding a plurality of components to a component pressure-bonding area in an edge portion of a substrate, the method comprising:
Dependencies are inferred from the claim text.