Method of manufacturing a circuit board
AssigneeIntel Corporation
InventorsJames A. McCALL, David Shykind
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.
Claims6
-5. (canceled)
A method of manufacturing a circuit board comprising:
- forming a first circuit board with horizontal and vertical fiberglass fibers;
- rotating said first circuit board;
- cutting said first circuit board wherein the horizontal and vertical fibers form a non-right angle with cut lines of said first circuit board;
- forming a second circuit board with horizontal and vertical fiberglass fibers;
- rotating said second circuit board;
- cutting said second circuit board into portions wherein the horizontal and vertical fibers form a second non-right angle with cut lines of said second circuit board;
- reforming a modified circuit board with portions of said first and second circuit boards.
A method of manufacturing a circuit board comprising:
- forming a herringbone pattern of first and second sets of fiberglass fibers;
- impregnating said fiberglass patter with an epoxy resin to form an FR4 circuit board;
- and
- forming first and second conductors on said FR4 circuit board.
Dependencies are inferred from the claim text.