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US 2010/0168279 A1Published application
Thermally curable epoxy-amine barrier sealants
OwnerShengqian Kong, Sarah E. Grieshaber +1inventors
InventorsShengqian Kong, Sarah E. Grieshaber, Donald E. Herr
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Abstract
This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.
Claims8
A curable barrier composition comprising
- (a) an aromatic compound having meta-substituted epoxy functionalities:
- in which
- R1, R2, R3, R4 are selected from the group consisting hydrogen, halogen, cyano, alkyl, aryl, and substituted alkyl or aryl groups, which may contain an epoxy functionality;
- R5, R6 are divalent hydrocarbon linkers having the general structure —CnH2n—, wherein n=0-4;
- in which any two of R1, R2, R3, R4, R5 and R6 may form part of the same cyclic structure;
- L1, L2, L3, L4, L5, L6 are a direct bond or a divalent linking group selected from the group consisting of
- EP and EP′ are curable epoxy functionalities selected from the group consisting of aliphatic epoxy, glycidyl ether, and cycloaliphatic epoxy in which hydrogens on the epoxy may be substituted by one or more alkyl or halogen groups.
- (b) a multifunctional aliphatic amine,
- (c) optionally, one or more fillers,
- (d) optionally, one or more adhesion promoters,
- (e) optionally, a phenolic cure accelerator.
8 more elements
(canceled)
8-14. (canceled)
Dependencies are inferred from the claim text.