US 2010/0168266 A1Published application

Photosensitive resin, method for preparing the resin, photosensitive resin composition and cured product of the resin composition

AssigneeLG Chem, Ltd.

InventorsMin Young Lim, Sung Hyung Kim, Han Soo Kim, Yoon Hee Heo, Dae Hyun Kim, Ji Heum Yoo, Sun Hwa Kim

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Abstract

Provided are a photosensitive resin and a photosensitive resin composition comprising the photosensitive resin. The photosensitive resin has the structure of Formula 1, which is described in the specification. The photosensitive resin and the photosensitive resin composition have good sensitivity, improved resistance to heat and chemicals, and excellent storage stability. Further provided are a method for preparing the photosensitive resin and a cured product of the photosensitive resin composition.

Claims25

Dependent claims

A photosensitive resin represented by Formula 1 :

wherein X is a tetravalent group derived from a polybasic acid anhydride, each R i is a hydrogen atom or a methyl group, and R2 is selected from methyl and ethyl groups.

A method for preparing a photosensitive resin, the method comprising the steps of:

mixing a) a diol compound having an acid group, b) a polybasic acid anhydride and c) a solvent to prepare a first solution;
heating the first solution;
controlling the temperature of the first solution;
and adding d) a compound having at least one ethylenically unsaturated group and at least one epoxy group in the molecule and e) a monohydric alcohol to the first solution, and stirring the mixture.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 12/448,678Filed 20 Aug 2008
Priority: KR 10-2007-009507119 Sep 2007
Published: 1 Jul 2010
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G03F 7/0007
Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor: filters, e.g.…
C08G 73/1003
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors: preparatory processes
G03F 7/032
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds: with binders
G03F 7/0388
Macromolecular compounds which are rendered insoluble or differentially wettable: with ethylenic or acetylenic bands in the side chains of the…

Family

US 8,252,879 B2Related patent
US 2010/0168266 A1This patent

From the US filing history. Foreign family members aren’t listed.

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