Electrocoated contacts compatible with surface mount technology
AssigneeLaird Technologies, Inc.
InventorPhilip van Haaster
Life of this patent
Estimating the term…
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AssigneeLaird Technologies, Inc.
InventorPhilip van Haaster
Estimating the term…
According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
A method of making a contact that is suitable for establishing electrical grounding contact from at least one electrically-conductive portion on a substrate to another electrically-conductive surface, the method comprising electrocoating at least one electrically-conductive layer onto a resilient dielectric material.
A method of installing a contact on an electrically-conductive surface, the contact having a resilient dielectric core with at least one electrically-conductive layer electrocoated thereon, the method comprising:
A contact for establishing electrical grounding contact from at least one electrically-conductive surface to another electrically-conductive surface, the contact comprising:
Dependencies are inferred from the claim text.