Structure and process for a contact grid array formed in a circuitized substrate

An electrical connector comprising:

• a dielectric substrate carrying a plurality of electrical traces extending therethrough;
• a two-dimensional sheet of electrically conducting material which has been formed into a plurality of three-dimensional shaped electrical contacts, each of the electrical contacts including a base portion which is secured to the substrate at a single point of contact and includes a bent portion extending away from the substrate and providing a resilient spring characteristic;
• and
• an electrical connection between at least some of the three-dimensional electrical contacts and the electrical traces.

A method of making an electrical connector having a plurality of conducting paths therethrough, the steps of the method comprising:

• forming a substrate with an electrically-conductive plane extending through the substrate and a plurality of electrical traces, at least some of the electrical traces coupled to the electrically-conductive plane;
• forming a plurality of three-dimensional elastic contacts in a sheet, each elastic contact having a base portion and a single elongated cantilevered arm;
• singulating the sheet into a plurality of separate electrical contacts and adhering the sheet to the substrate attached to the substrate at a single point of contact for at least some of the electrical contacts;
• and
• electrically coupling at least some of the elastic contacts to some of the electrical traces.