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US 2010/0167546 A1Published application
Method and Composition for Chemical Mechanical Planarization of A Metal or A Metal Alloy
AssigneeDoPont Air Products Nanomaterials LLC
InventorsXiaobo Shi, Bentley J. Palmer, Rebecca A. Sawayda
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Abstract
A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing.
Claims17
A method for chemical mechanical planarization of a surface having at least one feature thereon comprising a metal or a metal alloy, said method comprising the steps of:
- A) placing a substrate having the surface having the at least one feature thereon comprising the metal or the metal alloy in contact with a polishing pad;
- B) delivering a polishing composition to the surface comprising:
- a) an abrasive;
- b) a naphthalene imide derivative;
- and
- c) an oxidizing agent;
- and
- C) polishing the substrate with the polishing composition.
5 more elements
A polishing composition comprising:
- a) an abrasive;
- b) a naphthalene imide derivative;
- and
- c) an oxidizing agent.
1 more element
Dependencies are inferred from the claim text.