Resist feature and removable spacer pitch doubling patterning method for pillar structures
AssigneeSanDisk 3D LLC
InventorsYung-Tin Chen, Steven J. Radigan
Life of this patent
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AssigneeSanDisk 3D LLC
InventorsYung-Tin Chen, Steven J. Radigan
Estimating the term…
A method of making a semiconductor device includes forming at least one layer over a substrate, forming at least two spaced apart features of imagable material over the at least one layer, forming sidewall spacers on the at least two features and filling a space between a first sidewall spacer on a first feature and a second sidewall spacer on a second feature with a filler feature. The method also includes selectively removing the sidewall spacers to leave the first feature, the filler feature and the second feature spaced apart from each other, and etching the at least one layer using the first feature, the filler feature and the second feature as a mask.
A method of making a semiconductor device, comprising:
A method of making a pillar shaped nonvolatile memory device array, comprising:
Dependencies are inferred from the claim text.