Substrate level bonding method and substrate level package

A substrate level bonding method, the method comprising:

• providing a first substrate having a plurality of holes passing from a first surface to a second surface of the first substrate, a plurality of unit substrate sections separated from each other by the holes, and a plurality of first substrate adhesion sections that are formed of Dry Film Resist (DFR) material and are formed on first surfaces of the unit substrate sections;
• curing first edge adhesion sections of the first substrate adhesion sections, which cover edges of the first surfaces of the unit substrate sections;
• and
• bonding a second substrate to the first substrate adhesion sections.

A substrate level package comprising:

• a plurality of unit substrate sections separated from each other by holes;
• a base substrate disposed to face the unit substrate sections;
• and
• a plurality of substrate adhesion sections which are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, at least one portion of the adhesion section being uncured.

A substrate level package comprising:

• a plurality of unit substrate sections separated from each other by holes;
• a lower substrate bonded to lower surfaces of the unit substrate sections;
• an upper substrate bonded to upper surfaces of the unit substrate sections;
• a plurality of first substrate adhesion sections, which are interposed between the unit substrate sections and the lower substrate to bond the unit substrate sections to the lower substrate and are formed of DFR material, whose at least one portion of the substrate adhesion sections not being cured;
• and
• a plurality of second substrate adhesion sections, which are interposed between the unit substrate sections and the upper substrate to bond the unit substrate sections to the upper substrate and are formed of DFR material, at least one of the second substrate sections not being cured.