Method of fabricating transistor for semiconductor device
AssigneeHynix Semiconductor Inc.
InventorMin-Jung Shin
Life of this patent
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Abstract
A method of fabricating a transistor in a semiconductor device includes forming a gate structure over a substrate, forming a first trench by etching the substrate on either side of the gate structure to a first depth, ion-implanting dopants of a first conductivity type to form a source/drain region in the substrate on the side of the gate structure with the first trench, etching the substrate on the side of the gate structure with the first trench to a second depth larger than the first depth to form a second trench, and growing an epitaxial layer within the second trench.
Claims14
A method of fabricating a transistor in a semiconductor device, the method comprising:
- forming a gate structure over a substrate;
- forming a first trench by etching the substrate on a side of the gate structure to a first depth;
- ion-implanting dopants of a first conductivity type to form a source/drain region in the substrate on the side of the gate structure with the first trench;
- etching the substrate on the side of the gate structure with the first trench to a second depth larger than the first depth to form a second trench;
- and
- growing an epitaxial layer within the second trench.
A method of fabricating a transistor in a semiconductor device, the method comprising:
- forming an isolation layer defining an active region on a substrate;
- forming a gate structure over the substrate having the isolation layer;
- etching a portion of the active region between the gate structure and the isolation layer to form a first trench to a first depth;
- forming a material layer over the resulting substrate structure;
- etching the material layer to partially expose the substrate covered by the material layer and leave a discontinuous layer of the material spacer over a sidewall of the gate structure and a sidewall of the isolation layer;
- and
- after forming a source/drain region underneath the first trench, etching the substrate underneath the first trench to a second depth larger than the first depth to form a second trench.
Dependencies are inferred from the claim text.