Semiconductor package substrate with metal bumps
OwnerRavikumar Adimula, Myung Jin Yiminventors
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Abstract
An apparatus and method of making a package substrate with metal bumps is presented. The package substrate comprises a substrate base and a plurality of metal bumps which are formed on the substrate base. A microelectronic die may thereafter be attached to the package substrate. Also presented is a method for attaching the package substrate to a printed circuit board (PCB).
Claims30
A package substrate to be attached to a microelectronic die, the package substrate comprising:
- a substrate base;
- and
- a plurality of copper (Cu) bumps formed on a first side of the substrate base, wherein a second side of the substrate is to be attached to a microelectronic die, the second side of the substrate opposite the first side.
A method of making a microelectronic package including a package substrate and a microelectronic die, the method comprising:
- forming a substrate base;
- forming a plurality of copper (Cu) bumps on a first side of the substrate base, wherein the package substrate comprises the plurality of Cu bumps and substrate base;
- and
- after forming the plurality of Cu bumps on the substrate base, attaching a microelectronic die to a second side of the substrate base, the second side opposite the first side of the substrate base.
The method of attaching a package substrate to contacts on a printed circuit board (PCB), the method comprising:
- depositing a solder material between the contacts on the PCB and a plurality of copper (Cu) bumps formed on a first side of a substrate base, wherein the package substrate is comprised of the plurality of Cu bumps and substrate base;
- and
- attaching the package substrate to the contacts of the PCB so that ends of the plurality of Cu bumps are connected to the contacts of the PCB with the deposit material between.
The method of 17, wherein the solder material is deposited on the ends of the plurality of Cu bumps.
The method of 17, wherein the solder material is deposited on the contacts of the PCB.
The method of 17, wherein the solder material is deposited on the contacts of the PCB and on the ends of the plurality of Cu bumps.
The method of attaching a package substrate to contacts of a printed circuit board (PCB), the method comprising:
- forming an adhesive layer between the contacts of the PCB and a plurality of copper (Cu) bumps formed on a first side a substrate base, wherein the package substrate comprises the plurality of Cu bumps and substrate base;
- and
- applying pressure to the package substrate and PCB so that an end of each Cu bump is pressed into the adhesive layer and coupling to the contacts of the PCB.
Dependencies are inferred from the claim text.