Double-sided donor for preparing a pair of thin laminae
AssigneeTwin Creeks Technologies, Inc.
InventorZuniga Steve
Life of this patent
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Abstract
A method for forming a photovoltaic cell is disclosed which comprises the steps of providing a semiconductor donor body having a first surface and a second surface opposite the first surface, cleaving a first portion from the first surface of the semiconductor donor body to form a first lamina of semiconductor material, wherein the first lamina of semiconductor material has a first lamina thickness, and cleaving a second portion from the second surface of the semiconductor donor body to form a second lamina of semiconductor material, wherein the second lamina of semiconductor material has a second lamina thickness.
Claims20
A method for forming a photovoltaic cell, the method comprising the steps of:
- providing a semiconductor donor body having a first surface and a second surface opposite the first surface;
- cleaving a first portion from the first surface of the semiconductor donor body to form a first lamina of semiconductor material, wherein the first lamina of semiconductor material has a first lamina thickness;
- and
- cleaving a second portion from the second surface of the semiconductor donor body to form a second lamina of semiconductor material, wherein the second lamina of semiconductor material has a second lamina thickness.
A method for forming a photovoltaic cell, the method comprising the steps of:
- providing a semiconductor donor body having a first surface and a second surface opposite the first;
- affixing the first surface of a semiconductor donor body to a receiving surface of a first receiver element;
- affixing the second surface of the semiconductor donor body to a receiving surface of a second receiver element;
- cleaving a first semiconductor lamina from the semiconductor donor body at a first cleave plane with the first semiconductor lamina remaining affixed to the first receiver element;
- and
- cleaving a second semiconductor lamina from the semiconductor donor body at a second cleave plane with the second semiconductor lamina remaining affixed to the second receiver element.
A method for forming a photovoltaic assembly comprising the steps of:
- providing a semiconductor donor body having a first surface and a second surface opposite the first;
- implanting one or more species of gas ions through the first surface of a semiconductor donor body to define a first cleave plane;
- implanting one or more species of gas ions through the second surface of the semiconductor donor body to define a second cleave plane;
- affixing the first surface of the semiconductor donor body to a first receiver element;
- affixing the second surface of the semiconductor donor body to a second receiver element;
- cleaving a first lamina from the semiconductor body at the first cleave plane with the first surface remaining affixed to the first receiver element;
- and
- cleaving a second lamina from the semiconductor body at the second cleave plane with the second surface remaining affixed to the second receiver element.
Dependencies are inferred from the claim text.