Organic electro luminescence device and fabrication method thereof

A method of fabricating an organic electro luminescence device, the method comprising:

• forming a thin film transistor on a substrate;
• forming a passivation layer directly over the thin film transistor;
• forming an opaque metal layer as a reflector over the passivation layer;
• patterning the passivation layer to form a contact hole;
• forming a first electrode layer over the opaque metal layer;
• patterning the first electrode layer to form a contact hole corresponding to the contact hole through the passivation layer and exposing an upper surface of a drain electrode of the thin film transistor at a predetermined portion of the first electrode and the passivation layer;
• forming a buffer layer on a predetermined portion of an upper surface of the first electrode;
• forming a barrier rib directly adjacent to the contact hole on the buffer layer;
• forming an organic emission layer within a region defined by the buffer layer;
• and
• forming a second electrode on the organic emission layer such that the second electrode is electrically connected with the drain electrode through the contact hole.

A method of fabricating an organic electro luminescence device, the method comprising:

• forming a thin film transistor on a substrate;
• forming a passivation layer directly over the thin film transistor;
• forming an opaque metal layer as a reflector over the passivation layer;
• forming a first electrode layer over the opaque metal layer;
• patterning the first electrode layer to form a contact hole;
• patterning the passivation layer to form a contact hole corresponding to the contact hole through the first electrode layer and exposing an upper surface of a drain electrode of the thin film transistor at a predetermined portion of the first electrode and the passivation layer;
• forming a buffer layer on a predetermined portion of an upper surface of the first electrode;
• forming an organic emission layer within a region defined by the buffer layer;
• forming a barrier rib directly adjacent to the contact hole on the buffer layer;
• and
• forming a second electrode on the organic emission layer such that the second electrode is electrically connected with the drain electrode through the contact hole.