Laser processing apparatus
OwnerHironaru YAMAGUCHI, Mikio Hongo +2inventors
InventorsHironaru YAMAGUCHI, Mikio Hongo, Mitsuyoshi Koizumi, Masaki Araki
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Abstract
A laser processing apparatus which achieves both shorter TAT and reduction in processing defects. In the apparatus, a laser radiation section, an undulation measurement section for measuring undulation of a substrate or a film thickness measuring section for measuring the thickness of a thin film formed on the substrate, and an optical inspection section for optically inspecting grooves formed by laser-processing the thin film on the substrate are fixed so that their positional relationship is kept constant.
Claims14
A laser processing apparatus comprising:
- a stage for carrying a substrate on which a thin film is formed;
- a laser radiation section for irradiating laser light on the thin film formed on the substrate placed on the stage to form grooves in the thin film;
- and
- a drive for scanning the substrate for the laser radiation section;
- the apparatus further comprising:
- a measurement section or inspection section for making a measurement or inspection of the substrate or the thin film;
- wherein the laser radiation section irradiates laser light on the substrate being scanned;
- and
- wherein the measurement section or the inspection section makes a measurement or an inspection of the substrate being scanned and irradiated with laser light, simultaneously with the laser radiation.
A laser processing method comprising the steps of:
- placing a substrate on which a thin film is formed, on a stage;
- and
- performing laser radiation and measurement or inspection of the substrate simultaneously while scanning the substrate on the stage.
Dependencies are inferred from the claim text.