Adhesive film and semiconductor device using same

Abstract

The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250° C., following heat treatment at a temperature of 150 to 230° C. for a period of 0.3 to 5 hours, is not less than 0.2 MPa: (wherein, the m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of —CH2—, —CHR— and —CR2— (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m≧0.85, and R2 represents a tetracarboxylic acid residue).

Dependencies are inferred from the claim text.