Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
AssigneeSundew Technologies, LLC
InventorOfer Sneh
Life of this patent
Estimating the term…
Abstract
A seal-protected perimeter partition valve apparatus defines a vacuum and pressure sealed space within a larger space confining a substrate processing chamber with optimized geometry, minimized footprint, and 360° substrate accessibility. A compact perimeter partitioned assembly with seal protected perimeter partition valve and internally contained substrate placement member further provides processing system modularity and substantially minimized system footprint.
Claims16
1-13. (canceled)
A substrate processing system comprising:
- an enclosed, sealable processing chamber;
- a substrate support member;
- and a substrate placement member;
- said substrate placement member including a vertical substrate placement actuator for providing vertical substrate translation;
- wherein said actuator is contained within said processing space.
A substrate processing system comprising:
- a substrate processing system vessel;
- a substrate processing chamber;
- and
- said processing system vessel comprising:
- a pressure tight vessel space;
- a top vessel plate;
- a bottom vessel plate;
- a top port;
- a bottom port;
- and
- said substrate processing chamber comprising:
- a perimeter partitioned assembly (PPA);
- a lid assembly;
- and
- said PPA comprising:
- a substrate supporting member;
- a perimeter partition valve (PPV);
- a PPV bonnet;
- a substrate placement member;
- a pumping port;
- and
- an accessory port;
- said lid assembly comprising:
- a gas delivery manifold;
- wherein said bottom port is formed within said bottom vessel plate of said processing system vessel and said top port is formed within said top vessel plate of said processing system vessel;
- wherein said PPV bonnet is pressure sealed to said bottom port of said processing system vessel and said lid assembly is pressure sealed to said top port of said processing system vessel to form said substrate processing chamber.
22-53. (canceled)
A method for vertically moving a substrate within a processing chamber, said method comprising:
- providing a processing chamber;
- providing a wafer placement member within said processing chamber, said wafer placement member including a pneumatic actuator;
- actuating said wafer placement member within said processing chamber;
- said actuating comprising:
- pressurizing said actuator to elevate said substrate placement member;
- and
- evacuating said actuator to lower said substrate placement member.
Dependencies are inferred from the claim text.