US 2010/0166955 A1 · SYSTEM AND METHOD FOR THIN FILM DEPOSITION

Abstract

A reaction chamber assembly suitable for forming thin film deposition layers onto solid substrates includes a reaction chamber and an input plenum for receiving source material from gas source containers and delivering a flow of source material into the reaction chamber uniformly distributed across a substrate support width. An output plenum connected between the reaction chamber and a vacuum pump uniformly removes an outflow of material from the reaction chamber across the substrate support width. The input plenum is configured to expand a volume of the source material and deliver the source material to the substrate support area with uniform source material flow distribution across the substrate support width. The output plenum is configured to remove the outflow material across the entire substrate support width and to compress the volume of outflow material prior to the outflow material exiting the output plenum. The resulting source material flow over substrates supported in the substrate support area is uniformly distributed across the substrate support width and unidirectional with a uniform flow velocity. The configuration of the reaction chamber assembly reduces pump down times.

Claims53

Dependent claims

A reaction chamber assembly suitable for depositing one or more solid material layers on one or more substrates contained therein comprising:

a substantially gas tight reaction chamber for enclosing the one or more substrates;
a source for delivering a flow of source material into the reaction chamber;
a substrate support area having an input side and an output side for supporting the one or more substrates in a flow of the source material flowing over the one or more substrates in a flow direction extending from the input side to the output side wherein the substrate support area has a support width and a support height that are both substantially orthogonal to the flow direction;
and,
an input plenum enclosing an input plenum conduit comprising a input plenum conduit first end for receiving the flow of source material from the source and an opposing input plenum conduit second end for delivering the flow material to the input side, wherein the input plenum conduit is shaped to substantially continuously expand in volume from the input plenum conduit first end to the input plenum conduit second end.

2 more elements

A method for depositing a thin film of solid material onto exposed surfaces of a substrate comprising the steps of:

supporting the substrate on a substantially horizontally disposed substrate tray wherein the substrate tray has a support width;
receiving a flow of source material from a source into a first end of an input plenum conduit disposed between the source and the reaction chamber;
expanding the volume of the flow of source material in a first cross section of the input plenum conduit;
and,
delivering the expanded flow of source material from a second end of the input plenum conduit into the reaction chamber over the entire support width.

2 more elements

Dependencies are inferred from the claim text.

System and method for thin film deposition

Life of this patent

System and method for thin film deposition

Life of this patent

Abstract

Claims53