Substrate processing apparatus, deposition method, and electronic device manufacturing method
AssigneeCanon Anelva Corporation
InventorAtsushi TAKEDA
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Abstract
A substrate processing apparatus includes a heating unit which has a plurality of heaters used to heat a substrate in a first process chamber, a temperature line sensor configured to measure temperatures of the substrate heated by the heating unit while the substrate is conveyed from the first process chamber to a second process chamber, a re-heating unit which has a plurality of heaters used to re-heat the substrate in the second process chamber, and an output control unit which controls an output of the re-heat unit based on the measurement results of the temperature measurement units.
Claims11
A substrate processing apparatus having a first process chamber, a second process chamber, and a convey unit used to convey a substrate, comprising:
- a heating unit configured to have a plurality of heaters used to heat the substrate in the first process chamber;
- a temperature line sensor configured to measure temperatures of the substrate heated by said heating unit while the substrate is conveyed from the first process chamber to the second process chamber using the convey unit;
- a re-heating unit configured to have a plurality of heaters used to re-heat the substrate in the second process chamber;
- and
- a first output control unit configured to control an output of said re-heating unit based on measurement results of said temperature line sensor.
A deposition method for depositing a film on a substrate using a substrate processing apparatus which has a first process chamber, a second process chamber, and a convey unit used to convey the substrate, the method comprising steps of:
- heating the substrate using a plurality of heaters in the first process chamber;
- measuring temperatures of the heated substrate using a temperature line sensor while the substrate is conveyed from the first process chamber to the second process chamber using the convey unit;
- re-heating the substrate using a plurality of heaters used to re-heat the substrate in the second process chamber based on measuring results in the measurement step;
- and
- depositing a film on the substrate re-heated in the re-heating step in the second process chamber.
Dependencies are inferred from the claim text.