Camera module array for obtaining compound images
AssigneeHon Hai Precision Industry Co., Ltd.
InventorJEN-TSORNG CHANG
Life of this patent
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Abstract
An exemplary camera module array includes lens modules, a first holder, image sensors, a second holder, an optical element, and an image processor. The lens modules are threadedly coupled to the first holder. The image sensors are in optical alignment with the lens modules in one-to-one relation. The image sensors are received in the second holder. The optical element is sandwiched between the first holder and the second holder. The image processor is electrically connected with the image sensors. The image processor is configured for processing image signals from the image sensors and thereby obtaining a compound image.
Claims20
A camera module array comprising:
- a plurality of lens modules;
- a first holder, the lens modules being threadedly coupled to the first holder;
- a plurality of image sensors in optical alignment with the lens modules in one-to-one relation;
- a second holder, the image sensors being received in the second holder;
- an optical element sandwiched between the first holder and the second holder;
- and
- an image processor electrically connected with the image sensors, the image processor being configured for processing image signals from the image sensors, and, accordingly, obtaining a compound image based on the image signals.
A camera module array comprising:
- a plurality of lens modules;
- a first holder, the lens modules being threadedly coupled to the first holder, the first holder comprising a first surface and at least one first glue trench defined in the first surface, the at least one first glue trench having adhesive received therein;
- a plurality of image sensors in optical alignment with the lens modules in one-to-one relation;
- a second holder, the image sensors being received in the second holder, the second holder comprising a second surface facing toward the first holder and at least one second glue trench defined in the second surface, the at least one second glue trench having adhesive received therein;
- an optical element sandwiched between the first holder and the second holder;
- and
- an image processor electrically connected with the image sensors, the image processor being configured for processing image signals from the image sensors and thereby obtaining a compound image based on the image signals.
Dependencies are inferred from the claim text.