Die defect inspecting system with a die defect inspecting function and a method of using the same

A die defect inspecting system with a die defect inspecting function, comprising:

• a wafer-positioning module for positioning a wafer, wherein the wafer has a plurality of dies;
• an image-capturing module disposed beside one side of the wafer-positioning module in order to capture an image of each die;
• a die-sucking module disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die;
• a die defect analyzing module electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard;
• a die-classifying module disposed beside one side of the image-capturing module in order to classify the dies into go dies that pass inspection standard and no-go dies that do not pass inspection standard;
• and
• a control module electrically connected to the wafer-positioning module, the image-capturing module and the die-sucking module, in order to control the wafer-positioning module to position the wafer, to control the image-capturing module to capturing the back image of each die, and to control the die-sucking module to suck, move and release each die.