Silicon condenser microphone
AssigneesAac Acoustic Technologies (Shenzhen) Co., Ltd., American Audio Components Inc.
InventorRUI ZHANG
Life of this patent
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Abstract
A silicon condenser microphone includes a silicon substrate defining an opening, a diaphragm supported above the substrate, a backplate opposite to the diaphragm for forming a capacitor together with the diaphragm. The diaphragm includes a central vibrating portion and a plurality of arms extending from an edge of the vibrating portion. Each of the arms includes a first end connecting to the edge of the vibrating portion and a linking portion extending along a path having the same outline as that of the vibrating portion.
Claims14
A silicon condenser microphone comprising:
- a silicon substrate defining an opening;
- a diaphragm supported above the substrate;
- a backplate opposite from the diaphragm for forming a capacitor together with the diaphragm;
- and wherein
- the diaphragm includes a central vibrating portion and a plurality of arms extending from an edge of the vibrating portion, each of the arm including a first end connecting to the edge of the vibrating portion and a linking portion extending along a path having the same outline as that of the vibrating portion.
A silicon condenser microphone comprising:
- a substrate having an opening;
- a diaphragm, located above the substrate, including a central vibrating portion and a plurality of arms extending from an edge of the vibrating portion, each of the arms including a first end connecting to the edge and a linking portion extending from the first end along a path;
- a backplate opposite from the diaphragm and having a plurality of through holes;
- and wherein
- a gap is formed between the linking portion and the edge, and the gap has an even width between the linking portion and the edge along the path.
Dependencies are inferred from the claim text.