Laser apparatus and manufacturing method thereof
AssigneeMitsubishi Electric Corporation
InventorJunji Fujino
Life of this patent
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Abstract
A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; mold resin that has a top surface, does not seal the first outer lead but does seal the first inner lead and leaves part of the first inner lead exposed on the top surface; a sub-mount comprising a mounting surface and a back surface facing each other, the mounting surface facing the top surface of the mold resin and the back surface being not covered with the mold resin; and a laser element mounted on the mounting surface of the sub-mount and electrically connected to the exposed part of the first inner lead.
Claims13
A laser apparatus comprising:
- a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead;
- a molded resin that has a top surface, does not seal the first outer lead, but does seal the first inner lead, and leaves part of the first inner lead exposed on the top surface;
- a sub-mount comprising a mounting surface and a back surface facing each other, the mounting surface facing the top surface of the mold resin and the back surface being not covered with the mold resin;
- and
- a laser element mounted on the mounting surface of the sub-mount and electrically connected to the part of the first inner lead that is exposed.
A method of manufacturing a laser apparatus, comprising:
- forming a lead frame having a first outer lead and a first inner lead connected to the first outer lead;
- not sealing the first outer leads but sealing the first inner lead, with mold resin and leaving part of the first inner lead exposed on a top surface of the mold resin;
- mounting a laser element on a mounting surface of a sub-mount, which has the mounting surface and a back surface facing each other;
- and
- making the mounting surface of the sub-mount mounted with the laser element face the top surface of the mold resin, making part of the laser element and the part of the first inner lead that is exposed face each other without the back surface of the sub-mount being covered with the mold resins and bonding the laser element and the first inner lead together via a first conductive material, wherein the first conductive material is supplied to part of the laser element before the laser element and the first inner lead are bonded together.
Dependencies are inferred from the claim text.