Semiconductor package and plasma display device including the same

A plasma display device, comprising:

• a plasma display panel that realizes an image via gas discharge;
• at least one circuit board that generates a driving signal of the plasma display panel;
• a semiconductor package that comprises a film substrate that relays a signal between the at least one circuit board and the plasma display panel, a semiconductor chip that is electrically connected to the film substrate, a reinforcement plate to which the film substrate and the semiconductor chip are in direct physical contact, and that provides a floating ground, and a connecting member that electrically connects the reinforcement plate and a ground of the semiconductor chip, and electrically connects the reinforcement plate and a ground of the film substrate;
• and
• a chassis that comprises at least one first combining boss for installing the semiconductor package, wherein the at least one first combining boss protrudes from the chassis.

A semiconductor package, comprising:

• a semiconductor chip on film (COF) substrate disposed on a reinforcement plate;
• an integrated circuit disposed on the reinforcement plate and the integrated circuit electrically connected to the COF substrate via first and second connectors;
• and
• the reinforcement plate being electrically connecting to the COF substrate and the integrated circuit via the first connector, with the first and second connector being electrically insulated.