Mounting structure of semiconductor package and plasma display device having the same

A mounting structure of a semiconductor package, comprising:

• a semiconductor package comprising:
• a reinforcing plate comprising:
• a first metal layer;
• a second metal layer;
• and
• an insulation substrate disposed between the first and second metal layers,
• the reinforcing plate having a coupling hole, the insulation substrate being exposed around the coupling hole;
• a substrate directly attached to the reinforcing plate, the substrate interfacing transmission of signals between a circuit board and a display panel;
• and
• a semiconductor chip directly attached to the reinforcing plate, the semiconductor chip an electrical contact point with the substrate;
• a chassis having a coupling boss protruding at a position corresponding to the coupling hole;
• and
• a coupling member penetrating the coupling hole and coupled to the coupling boss.

A plasma display device comprising:

• a plasma display panel forming an image by using gas discharge;
• at least one circuit board generating a drive signal for the plasma display panel;
• a semiconductor package comprising:
• a reinforcing plate having a coupling hole;
• a substrate directly attached to the reinforcing plate, the substrate interfacing transmission of signals between the circuit board and the plasma display panel;
• and
• a semiconductor chip directly attached to the reinforcing plate, the semiconductor chip forming an electrical contact point with the substrate;
• a chassis having a coupling boss protruding at a position corresponding to the coupling hole;
• a coupling member penetrating the coupling hole and coupled to the coupling boss;
• and
• an insulation member covering around the coupling hole of the reinforcing plate and making insulation contact with the coupling member and the coupling boss.

A plasma display device comprising:

• a plasma display panel forming an image by using gas discharge;
• at least one circuit board generating a drive signal for the plasma display panel;
• a semiconductor package comprising:
• a reinforcing plate comprising:
• a first metal layer;
• a second metal layer;
• and
• an insulation substrate disposed between the first and second metal layers,
• the reinforcing plate having a coupling hole, the insulation substrate being exposed around the coupling hole;
• a substrate directly attached to the reinforcing plate, the substrate interfacing transmission of signals between the circuit board and the plasma display panel;
• and
• a semiconductor chip directly attached to the reinforcing plate, the semiconductor chip forming an electrical contact point with the substrate;
• a chassis having a coupling boss protruding at a position corresponding to the coupling hole;
• and
• a coupling member penetrating the coupling hole and coupled to the coupling boss.