Electronic device, electronic component, and method of manufacturing electronic device

A method of manufacturing an electronic device in which an electronic component is attached to a first surface of a circuit board, the method comprising:

• placing, on the first surface, the electronic component comprising a contact surface in contact with the first surface, and comprising a center of gravity at a location other than the center of the contact surface and a metal material in the electronic component;
• temporarily attaching the electronic component to the first surface with the contact surface being in contact with the first surface by a magnetic force attracting the metal material from a second surface of the circuit board opposite to the first surface;
• and
• attaching the electronic component on the circuit board with an attaching module while the electronic component is being temporarily attached to the circuit board.