Memory card and method for manufacturing the same

A memory card comprising:

• a circuit board including at least a board electrode on its top face and an external electrode on its bottom face;
• a first semiconductor chip including a first semiconductor electrode mounted on the top face of the circuit board;
• a third semiconductor chip including a third semiconductor electrode mounted in an area on the top face of the circuit board, the area being different from an area where the first semiconductor chip is mounted;
• a second semiconductor chip including a second semiconductor electrode on its top face;
• a wire for connecting the second semiconductor electrode and the board electrode;
• and
• a cover for covering a circuit formation area, the circuit formation area including the first semiconductor chip, the second semiconductor chip, the third semiconductor chip, and the wire provided on the top face of the circuit board;
• a primary sealing resin for sealing the first semiconductor chip;
• a secondary sealing resin for sealing the wire;
• wherein
• at least a part of a bottom face of the second semiconductor chip and a part of a top face of the first semiconductor chip face each other and are fixed;
• and
• at least a part of the second semiconductor chip, a part of the third semiconductor chip, a part of the circuit board are covered with sealing resin.