Power semiconductor module system
AssigneeInfineon Technologies AG
InventorMichael Hornkamp
Life of this patent
Estimating the term…
Abstract
A power semiconductor module system. One embodiment provides a power semiconductor module and a mounting adapter. The mounting adapter and the power semiconductor module can be latched to one another in two different latching stages such that a contact element of the power semiconductor module makes electrical contact with a contact element of the mounting adapter assigned to the contact element in a second one of the latching stages but not in a first one of the latching stages.
Claims25
A power semiconductor module system comprising:
- a mounting adaptor for producing electrically conductive connections between a circuit carrier and a power semiconductor module, the mounting adapter comprising electrically conductive contact elements for the electrical contact-connection of a power semiconductor module, wherein each of the contact elements is electrically conductively connected to a solderable terminal location of the mounting adapter;
- and
- a power semiconductor module comprising electrically conductive contact elements configured to be electrically contact-connected to an assigned contact element of the mounting adaptor;
- wherein the mounting adapter and the power semiconductor module can be latched to one another in two different latching stages such that at least one of the contact elements of the power semiconductor module makes electrical contact with that contact element of the mounting adapter which is assigned to the contact element in a second one of the latching stages but not in a first one of the latching stages.
A power semiconductor module arrangement comprising a power semiconductor module system with a mounting adaptor for producing electrically conductive connections between a circuit carrier and a power semiconductor module, the mounting adapter comprising electrically conductive contact elements for the electrical contact-connection of a power semiconductor module, wherein each of the contact elements is electrically conductively connected to a solderable terminal location of the mounting adapter;
- a power semiconductor module comprising electrically conductive contact elements configured to be electrically contact-connected to an assigned contact element of the mounting adaptor;
- wherein the mounting adapter and the power semiconductor module are configured to be latched to one another in two different latching stages such that at least one of the contact elements of the power semiconductor module makes electrical contact with that contact element of the mounting adapter assigned to the contact element in a second one of the latching stages but not in a first one of the latching stages;
- and
- a circuit carrier comprising a conductor track structure with electrical terminal locations, wherein each of the terminal locations of the mounting adapter is soldered to an assigned terminal location of the circuit carrier.
A method for producing a power semiconductor module arrangement, the method comprising:
- providing a circuit carrier comprising a conductor track structure with electrical terminal locations;
- providing a power semiconductor module system with a mounting adaptor for producing electrically conductive connections between a circuit carrier and a power semiconductor module, the mounting adapter comprising electrically conductive contact elements for the electrical contact-connection of a power semiconductor module, wherein each of the contact elements is electrically conductively connected to a solderable terminal location of the mounting adapter;
- a power semiconductor module comprising electrically conductive contact elements which can in each case be electrically contact-connected to an assigned contact element of the mounting adaptor;
- wherein the mounting adapter and the power semiconductor module can be latched to one another in two different latching stages such that at least one of the contact elements of the power semiconductor module makes electrical contact with that contact element of the mounting adapter assigned to the contact element in a second one of the latching stages but not in a first one of the latching stages;
- wherein at least one of the contact elements of the power semiconductor module has no electrical contact with that contact element of the mounting adapter assigned to the contact element;
- soldering the terminal locations of the mounting adapter to terminal locations of the circuit carrier;
- and
- producing an electrical contact between the at least one contact element of the power semiconductor module and that contact element of the mounting adapter assigned to the contact element after soldering.
A power semiconductor module system comprising:
- a mounting adaptor configured for producing electrically conductive connections between a circuit carrier and a power semiconductor module, the mounting adapter comprising electrically conductive contact elements for the electrical contact-connection of a power semiconductor module;
- wherein the mounting adapter and the power semiconductor module are configured to be latched to one another in two different latching stages such that at least one of the contact elements of the power semiconductor module makes electrical contact with a contact element of the mounting adapter in a second one of the latching stages but not in a first one of the latching stages.
Dependencies are inferred from the claim text.