Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
AssigneeSTMicroelectronics S.r.l.
InventorsFederico Giovanni ZIGLIOLI, Mark Andrew SHAW
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Abstract
An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks.
Claims66
Package for Micro-Electro-Mechanical Systems of the MEMS type comprising:
- a base for the assembly of MEMS components;
- a protective envelope for containing said MEMS components;
- wherein said base is a multi-layer structure with at least one layer of composite material that makes a substrate and at least one flexible wing projecting from said substrate, said base being a monolithic element suitable for being connected to external connection tracks.
Process for manufacturing a package for micro-electro-mechanical systems of the MEMS type that comprises a base for the assembly of MEMS components and a protective envelope for containing said MEMS components, comprising the following steps of:
- providing a multi-layer structure that defines a base comprising a substrate, with at least one layer of composite material, and at least one flexible wing projecting from said substrate, said base being a monolithic element;
- associating said MEMS components with said base;
- making said protective envelope for said base;
- connecting said base to external connection tracks.
An apparatus, comprising:
- a first housing;
- and
- a first substrate disposed in the first housing and including a first layer having a first portion that extends out from the housing.
A system, comprising:
- an apparatus, comprising
- a housing, and
- a first substrate disposed in the housing and including a layer having a portion that extends out from the housing;
- and
- an integrated circuit coupled to the apparatus.
A method, comprising:
- forming a first structure including a first layer having a first size in a first dimension and a second layer having a second size in the first dimension, the second size greater than the first size;
- and
- encapsulating the first layer and a first portion of the second layer such that a second portion of the second layer remains unencapsulated.
Dependencies are inferred from the claim text.