Heat dissipation device

An electronic assembly comprising:

• an add-on card comprising a first primary electronic component, a second primary electronic component, the first and second primary electronic components spaced from each other and generating different amounts of heat during operation thereof;
• two heat sinks, each of the heat sinks comprising a base and a fin group mounted on a top surface of the base, the bases of the two heat sinks contacting the first and second primary electronic components of the add-on card, respectively;
• and
• a heat pipe comprising a first connecting section and two first heat-conductive sections extending from opposite ends of the first connecting section, wherein one of the two first heat-conductive sections is sandwiched between the base and the fin group of one heat sink, and another of the two first heat-conductive sections is sandwiched between the base and the fin group of another heat sink.