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US 2010/0165525 A1Published application
Low Profile Discrete Electronic Components and Applications of Same
AssigneeInterconnect Portfolio LLC
InventorsJoseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber
Life of this patent
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Abstract
Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
Claims22
(canceled)
An electrostatic discharge protective device comprising:
- a first conductive contact having an upward facing planar surface;
- a second conductive contact having a downward facing planar surface substantially parallel to the upward facing planar surface;
- an insulating layer disposed between the first and second conductive contact elements, the insulating layer having an opening therein;
- and
- a voltage switchable dielectric layer disposed within the opening and in contact with the first and second conductive contact.
2 more elements
An electrical assembly comprising:
- a printed circuit board with a metal layer having a signal trace;
- an electrostatic discharge protective device comprising i) a first conductive contact having a first surface conductively coupled with the signal trace, ii) a second conductive contact having a second surface substantially parallel to the first surface, iii) an insulating layer disposed between the first and second conductive contact elements, the insulating layer having an opening therein, and iv) a voltage switchable dielectric layer disposed within the opening and in contact with the first and second conductive contact.
Dependencies are inferred from the claim text.