Integrated electronic device with transceiving antenna and magnetic interconnection

A method for testing vias of magnetic material of at least two integrated electronic devices formed in a wafer, each integrated electronic device comprising at least one own via and at least one own antenna at least partially overlying or surrounding said own via;

• the method comprising the steps of:
• positioning said wafer on a support comprising a resting surface and a supporting layer of magnetic material, with the vias facing said support;
• supplying said at least two integrated electronic devices;
• and
• verifying the magnetic or electromagnetic coupling between the antennas of said at least two integrated electronic devices.

A method for testing a via of magnetic material of an integrated electronic device formed in a wafer, said integrated electronic device comprising at least one own via and at least one own antenna at least partially overlying or surrounding said own via;

• the method comprising the steps of:
• positioning said wafer on a support, with said antenna facing said support;
• and
• providing a probe card comprising at least one test antenna and at least one magnetic core;
• and
• setting said probe card in such a way that said at least one magnetic core and said via are arranged between said at least one test antenna and the antenna of said integrated electronic device.

A method for testing vias of magnetic material of a plurality of integrated electronic devices formed in a wafer, each integrated electronic device having a top surface and a bottom surface and comprising at least one own via and at least one own antenna at least partially overlying or surrounding said own via, said at least one antenna and said at least one via being close to said top surface and to said bottom surface, respectively;

• said method comprising the steps of:
• positioning said wafer on a support, with the antennas facing said support;
• and
• depositing strips of magnetic material on the bottom surfaces of said integrated electronic devices in such a way that each via is magnetically connected to at least another via by means of said strips.

A method for testing vias of magnetic material of at least one integrated electronic device formed in a wafer, the integrated electronic device comprising at least one own via and at least one own antenna;

• the method comprising the steps of:
• positioning said wafer on a support comprising a winding of conductive material;
• and
• electrically or electromagnetically coupling said at least one integrated electronic device with a test equipment by means of said winding.

A semiconductor structure, comprising:

• a semiconductor layer;
• a first magnetic region disposed in the layer;
• and
• a first winding operable to generate a magnetic flux in the first magnetic region.

An integrated circuit, comprising:

• a semiconductor layer;
• a first magnetic region disposed in the layer;
• and
• a first winding defining an inner region that is at least partially aligned with the magnetic region.

A system, comprising:

• a first integrated circuit including
• a first semiconductor layer;
• a first magnetic region disposed in the layer;
• and
• a first winding defining an inner region that is at least partially aligned with the magnetic region;
• and
• a second integrated circuit coupled to the first integrated circuit.

A method, comprising:

• driving a first winding with a signal to generate a magnetic flux, the first winding forming part of a semiconductor structure;
• conducting at least a portion of the magnetic flux with a magnetic region that forms part of the semiconductor structure;
• and
• inducing in a second winding with the portion of the flux substantially the signal, the second winding forming part of the semiconductor structure.

A method, comprising:

• driving a first winding with a signal to generate a magnetic flux, the first winding forming part of a first integrated circuit;
• conducting at least a first portion of the magnetic flux with a first magnetic region that forms part of the first integrated circuit;
• conducting at least a second portion of the magnetic flux with a second magnetic region that forms part of a second integrated circuit;
• and
• inducing in a second winding with the second portion of the magnetic flux substantially the signal, the second winding forming part of the second integrated circuit.