Apparatus and method for measuring characteristics of semiconductor device
AssigneeDongbu HiTek Co., Ltd.
InventorsChan-Ho Park, Won-Young Jung
Life of this patent
Estimating the term…
Loading patent…
AssigneeDongbu HiTek Co., Ltd.
InventorsChan-Ho Park, Won-Young Jung
Estimating the term…
An apparatus and method for measuring the characteristics of a semiconductor device is disclosed. The measuring apparatus may include first to M-th (wherein M is a positive integer not less than 1) starved devices each being biased in response to a bias voltage varying in accordance with a variable first supply voltage, thereby varying an amount of current flowing through a semiconductor device included in the starved device. Interconnect lines may interconnect the first to M-th starved devices. A measuring unit measures at least one of a delay time caused by the semiconductor devices of the starved devices themselves, and a compound delay time caused by the semiconductor devices of the starved devices themselves plus a delay time caused by the interconnect lines. The measured results can be analyzed under conditions more approximate to diverse situations exhibited in practical chips in accordance with development of manufacturing processes and techniques. It is also possible to provide the basis of a model which more effectively represents coupling geometry of more complex semiconductor devices and interconnect lines. The basis of the model may be applied to development of various tools, etc.
An apparatus comprising:
The apparatus of claim 5, wherein the starved devices are connected in the form of a chain by the interconnect lines.
A method for measuring characteristics of semiconductor devices in a characteristic measuring apparatus including a current amount varying unit being biased in response to a bias voltage flowing through each of the semiconductor devices, a bias voltage supply unit for outputting the bias voltage, which is varied in accordance with a variable supply voltage, to the current amount varying unit, and a measuring unit for measuring the characteristics of the semiconductor devices, which are connected by interconnect lines, comprising:
Dependencies are inferred from the claim text.