Mems probe for probe cards for integrated circuits

A method for verifying the integrity of a microelectromechanical probe adapted to contact a corresponding terminal of an integrated circuit, integrated on at least one chip of a semiconductor material wafer during a test phase of the wafer, said probe including:

• a support structure comprising a first access terminal and a second access terminal, said support structure defining a conductive path between said first access terminal and said second access terminal;
• a probe region connected to the support structure, said probe region comprising at least one conductive tip adapted to contact the corresponding terminal of the integrated circuit during the test phase for:
• providing at least one test signal received from the first access terminal and the second access terminal to the integrated circuit through at least one portion of the conductive path, and/or
• providing at least one test signal generated by the integrated circuit to at least one between the first access terminal and the second access terminal trough at least one portion of the conductive path, said probe region is arranged on the conductive path of the support structure between said first access terminal and said second access terminal, said method for verifying including:
• accessing the first and the second input terminals with a measuring device;
• stimulating the probe with said measuring device in such a way the conductive path is crossed by a measuring current (Im), and
• assessing the integrity of the probe based on the measuring current.