Zif connectors and semiconductor testing device and system using the same

A semiconductor testing device, comprising a connector board, a test load board, and a probe card, wherein the connector board comprises a plurality of ZIF connectors and guides the ZIF connectors to connect with the test load board, the test load board being electrically connected to the probe card, the probe card comprising probes for testing a wafer to be tested, the semiconductor testing device being characterized in:

• each said ZIF connector comprising a body portion and a clamping portion, wherein:
• the body portion is an embedded print circuit board with circuit patterns and the body portion comprises:
• a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of signal cables;
• and
• a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two opposite lateral sides of the body portion for electrically connecting a plurality of electrical pads of a substrate, wherein the circuit patterns of the body portion electrically connect to the electrical terminals through the signal holes;
• and
• the clamping portion is horizontally extended on one said lateral side of the body portion for securing each said ZIF connector in the connector board.

A semiconductor testing device, comprising a wafer chuck, a probe card, a test load board, and a connector board, wherein the connector board comprises a plurality of ZIF connectors and guides the ZIF connectors to connect with the test load board, the test load board being electrically connected to the probe card, the wafer chuck being movable in X-Y-Z directions and configured for carrying a wafer to be tested, the probe card comprising probes for testing the wafer to be tested, the semiconductor testing device being characterized in:

• each said ZIF connector comprising a body portion and a clamping portion, wherein:
• the body portion is an embedded print circuit board with circuit patterns and the body portion comprises:
• a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of signal cables;
• and
• a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two opposite lateral sides of the body portion for electrically connecting a plurality of electrical pads of a substrate, wherein the circuit patterns of the body portion electrically connect to the electrical terminals through the signal holes;
• and
• the clamping portion is horizontally extended on one said lateral side of the body portion for securing each said ZIF connector in the connector board.

A semiconductor testing system, provided for testing a wafer, comprising a prober and a motherboard, wherein:

• the prober at least comprises a wafer chuck, a probe card, a test load board, and a connector board, the connector board comprising a plurality of ZIF connectors and guiding the ZIF connectors to connect with the test load board, the test load board being electrically connected to the probe card, the wafer chuck being movable in X-Y-Z directions and configured for carrying a wafer to be tested, the probe card comprising probes for testing the wafer to be tested;
• and
• the motherboard has a plurality of female connectors corresponding to the ZIF connectors so as to connect therewith and provide proper testing signals according to testing specifications of the wafer to be tested;
• the semiconductor testing system being characterized in:
• each said ZIF connector comprising a body portion and a clamping portion, wherein:
• the body portion is an embedded print circuit board with circuit patterns and the body portion comprises:
• a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of signal cables;
• a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two opposite lateral sides of the body portion for electrically connecting a plurality of electrical pads of the motherboard, wherein the circuit patterns of the body portion electrically connect to the electrical terminals through the signal holes;
• and
• the clamping portion is horizontally extended on one said lateral side of the body portion for securing each said ZIF connector in the connector board.

A semiconductor testing device, provided for testing an IC element, comprising a connector board, a probe card and a socket, the connector board comprising a plurality of ZIF connectors and guiding the ZIF connectors to connect with the probe card, the probe card being electrically connected to the socket, the socket serving to receive the IC element and comprising a plurality of probes passing lengthwise through the socket for electrically contacting the IC element,

• the semiconductor testing device being characterized in:
• each said ZIF connector comprising a body portion and a clamping portion, wherein:
• the body portion is an embedded print circuit board with circuit patterns and the body portion comprises:
• a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of signal cables;
• a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two opposite lateral sides of the body portion for electrically connecting a plurality of electrical pads of a substrate, wherein the circuit patterns of the body portion electrically connect to the electrical terminals through the signal holes;
• and
• the clamping portion is horizontally extended on one said lateral side of the body portion for securing each said ZIF connector in the connector board.

A semiconductor testing system, provided for testing an IC element, comprising a connector board, a probe card, a socket, a pressing arm and an adaptor board, the connector board comprising a plurality of ZIF connectors and guiding the ZIF connectors to connect with the probe card, the probe card being electrically connected to the socket, the socket serving to receive the IC element and comprising a plurality of probes passing lengthwise through the socket for electrically contacting the IC element, the pressing arm pressing upon the IC element to make the IC element contact the probes of the socket,

• the semiconductor testing system being characterized in:
• each said ZIF connector comprising a body portion and a clamping portion, wherein:
• the body portion is an embedded print circuit board with circuit patterns and the body portion comprises:
• a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of signal cables;
• a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two opposite lateral sides of the body portion for electrically connecting a plurality of electrical pads of a substrate, wherein the circuit patterns of the body portion electrically connect to the electrical terminals through the signal holes;
• and
• the clamping portion is horizontally extended on one said lateral side of the body portion for securing each said ZIF connector in the connector board.