Method and apparatus for testing integrated circuit

An electrical test apparatus for testing an integrated circuit, comprising:

• a probe card including a probe base plate having a plurality of electrically conducting paths and power supply paths, and a plurality of contacts arranged on one face of said probe base plate and having a plurality of contacts electrically connected to said electrically conducting paths;
• a chuck top in which said integrated circuit is to be disposed is movable among a test site where the received integrated circuit opposes said probe card, a non-test site where the received integrated circuit does not oppose said probe card, and a retreat position where the received integrated circuit does not oppose said probe card;
• a heating element disposed on said probe base plate so as to generate heat by a power for heating to be supplied through said power supply path;
• a first sensor for outputting an electrical signal for use in determining whether or not said chuck top is located near said probe card;
• a second sensor disposed in said probe card to detect temperature of said probe card;
• and
• a controller for controlling a test signal to be supplied to said probe card and power for heating to be supplied to said heating element, and adjusting the amount of supply of said power for heating by determining at least one selected from a group including whether or not said chuck top exists near said probe card on the basis of an output signal of said first sensor, whether or not said test signal is supplied to said integrated circuit, and determining, on the basis of an output signal of said second sensor, whether or not said probe card has a given temperature, and according to a determination result, adjusting the amount of the supply of the power for heating.

An electrical test apparatus of an integrated circuit, comprising:

• a probe card having a plurality of electrically conductive paths as well as power supply paths and a plurality of contacts which are arranged on one face of said probe base plate and electrically connected to said conductive paths;
• a chuck top in which said integrated circuit is to be disposed is movable among a test site where the received integrated circuit opposes said probe card, a non-test site where the received integrated circuit does not oppose said probe card, and a retreat position where the received integrated circuit does not oppose said probe card;
• a heating element disposed on said probe base plate so as to generate heat by a power for heating supplied through said power supply paths;
• a sensor which outputs an electrical signal to be used for determining whether or not said chuck top exists near said probe card;
• and
• a controller for controlling a test signal to be supplied to said probe card and controlling power for heating to be supplied to said heating element, determining, on the basis of the output signal of said sensor, whether or not said chuck top exists near said probe card and whether or not said test signal is supplied to said integrated circuit, and, according to both determination results, adjusting the amount of supply of said power for heating.

An electrical test apparatus for testing an integrated circuit, comprising:

• a probe base plate having a plurality of electrically conducting paths and power supply paths as well as a probe card disposed on one face of said probe base plate and including a plurality of contacts electrically connected to said conductive paths;
• a chuck top in which said integrated circuit is to be disposed is movable among a test site where the received integrated circuit opposes said probe card, a non-test site where the received integrated circuit does not oppose said probe card, and a retreat position where the received integrated circuit does not oppose said probe card;
• a heating element disposed on said probe base plate so as to generate heat by the power for heating to be supplied through said power supply paths;
• a sensor disposed in said probe card so as to detect temperature of said probe card;
• and
• a controller for controlling a test signal to be supplied to said probe card and controlling power for heating to be supplied to said heating element, determining, on the basis of an output signal of said sensor, whether or not said test signal is supplied to said integrated circuit and, on the basis of an output signal of said sensor, whether or not said probe card has a given temperature, and according to both determination results, adjusting the amount of supply of said power for heating.