Probe card

A probe card that electrically connects a semiconductor wafer as a test object and a circuit structure that generates a signal for a test, the probe card comprising:

• a plurality of probes that is made of a conductive material and comes into contact with the semiconductor wafer to receive or output an electric signal;
• a probe head that houses and holds the probes;
• a substrate that includes wires electrically connected to the circuit structure;
• a space transformer that transforms intervals between the wires of the substrate and causes the wires to come out to a surface of the space transformer on a side opposing the probe head;
• and
• a holding unit that holds the probe head and the space transformer by pressing a portion near an edge portion of each of the probe head and the space transformer in a direction of the substrate, wherein
• a point of application of force applied from the holding unit to the probe head is positioned inside of an outer edge of the probe head and/or a point of application of force applied from the holding unit to the space transformer is positioned inside of an outer edge of the space transformer.