Liquid tim dispense and removal method and assembly
AssigneeIntel Corporation
InventorsNader Abazarnia, Ashish X. Gupta, Suzana Prstic
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Abstract
In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.
Claims20
A method comprising:
- loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM);
- pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released;
- testing the integrated circuit device;
- and
- removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed.
An apparatus comprising:
- a chuck to provide mechanical support;
- a thermal solution to distribute heat;
- a pressure device to apply a force upon the thermal solution;
- and
- an absorbent material coupled with the thermal solution to hold a liquid thermal interface material (TIM).
An apparatus comprising:
- an integrated circuit device package;
- a test platform to receive and test the integrated circuit device package;
- and
- a thermal control unit to control the thermal solutioning of the integrated circuit device package, the thermal control unit including an absorbent material to release a liquid thermal interface material (TIM) when pressed against the integrated circuit device package.
Dependencies are inferred from the claim text.