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US 2010/0164368 A1Published application
Radiation- or thermally-curable barrier sealants
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsShengqian Kong, Sarah E. Grieshaber
Life of this patent
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Abstract
This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
Claims14
A curable barrier composition comprising
- (a) an aromatic compound with meta-substituted reactive groups having the structure:
- in which
- R1, R2, R3, R4 are selected from the group consisting hydrogen, halogen, cyano, alkyl, aryl, and substituted alkyl or aryl groups, R5, R6 are divalent hydrocarbon linkers having the general structure —CnH2n—, where n=0-4, in which any two of R1, R2, R3, R4, R5 and R6 may form part of the same cyclic structure;
- L1, L2, L3, L4, L5, L6 are a direct bond or a divalent linking group selected from the group consisting of
- RF and RF′ are curable functionalities selected from the group consisting of aliphatic epoxy, glycidyl ether, cycloaliphatic epoxy, hydroxyl, vinyl ether, propenyl ether, crotyl ether, styrenic, acrylate, methacrylate, itaconate, malelmide, maleate, fumarate, cinnamate, acrylamide, methacrylamide, chalcone, thiol, allyl, alkenyl, and cycloalkenyl groups.
- (b) a cationic or radical Initiator or both,
- (c) optionally, one or more fillers,
- (d) optionally one or more adhesion promoters
5 more elements
Dependencies are inferred from the claim text.