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US 2010/0164127 A1Published application
Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
AssigneeNitto Denko Corporation
InventorHiroshi Noro
Life of this patent
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Abstract
The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.
Claims7
An epoxy resin composition for photosemiconductor element encapsulation, said epoxy resin composition comprising the following components (A) to (D):
- (A) an epoxy resin having two or more epoxy groups in one molecule thereof,
- (B) an acid anhydride curing agent,
- (C) a curing accelerator, and
- (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.
1 more element
Dependencies are inferred from the claim text.